めっき処理装置

Japanese Patent JP6735014

B2

A plating processing apparatus in which a plating object is immersed in a plating solution to form a plating layer on a surface of the plating object, the plating processing apparatus including a plating tank containing the plating solution, a power supply roller rotated while supplying electric power to the plating object, and conveying the plating object to be immersed into the plating solution contained in the plating tank and then moved to the outside of the plating solution, an anode case disposed inside the plating tank and held in electrical contact with the plating solution contained in the plating tank, a control panel controlling electric power supplied to the power supply roller and the anode case, a first busbar electrically connecting the power supply roller and the control panel, and a second busbar electrically connecting the anode case and the control panel, wherein the first busbar and the second busbar are each constituted by a plurality of busbar members each of which includes a copper-made base member and a titanium-made coating layer covering a surface of the base member, the first busbar and the second busbar include a first connection portion in which the busbar members are connected to each other and a second connection portion in which the busbar member is connected to the power supply roller, the anode case, or the control panel, and a portion of the busbar member other than the first connection portion and the second connection portion includes a gap between the base member and the coating layer.

JP4920365

Processing tank

Hitoshi Tsuchida
Ryuichi Yoshikawa

JP2019519782A

August 05, 2020

January 23, 2019

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Toyama Sumitomo Electric Co., Ltd.

C25D7/06; C25D21/00

JP1046398A
JP336291A
JP1219192A
JP62164899A
JP62164898A
JP6117396A
JP7282869A
JP2004315937A

Masami Sakai
Yoshikuni Suda

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