Title:
鍍金性改良剤、鍍金用成形体、鍍金成形体及び鍍金方法
Document Type and Number:
Japanese Patent JP7143063
Kind Code:
B2
Abstract:
To provide a plating improver which is blended in a molding material forming a resin molded body for plating together with a thermoplastic resin, and provides a molded body for plating that is excellent in impact resistance and can efficiently form a metal film or an alloy film thereon by plating, a molded body for plating, and the like.SOLUTION: A plating improver contains heterogenous phase polymer particles having a coefficient of variation of a particle diameter of 40-90%, where a content ratio of the polymer particles having a particle diameter of 0.05 μm or more is 80 vol.% or more based on the whole heterogenous phase polymer particles, and a content ratio of the polymer particles having a particle diameter of 0.05 μm or more and less than 0.15 μm is 10-60 vol.% based on the whole heterogenous phase polymer particles.SELECTED DRAWING: None
Inventors:
Yuka Tanaka
Nori Ohno
Hiroki Kitaguchi
Atsushi Watanabe
Nori Ohno
Hiroki Kitaguchi
Atsushi Watanabe
Application Number:
JP2017134125A
Publication Date:
September 28, 2022
Filing Date:
July 07, 2017
Export Citation:
Assignee:
Techno umg corporation
International Classes:
C08F279/02; C08L51/04; C08L101/00; C23C18/16; C25D5/56
Domestic Patent References:
| JP2011236263A | ||||
| JP2010126631A | ||||
| JP2002338636A | ||||
| JP2007177223A |
Other References:
高分子機械材料委員会,ABS樹脂,日本,社団法人高分子学会,1970年08月31日,pp.158-159
Attorney, Agent or Firm:
Kojima Kiyoji
Yasuyuki Hiraiwa
Suzuki Katsuma
Yasuyuki Hiraiwa
Suzuki Katsuma
Previous Patent: Plating improver, molded article for plating, molded article and plating method
Next Patent: inspection probe
Next Patent: inspection probe