Title:
めっき処理用治具及びめっき処理装置
Document Type and Number:
Japanese Patent JP7034083
Kind Code:
B2
Abstract:
[Problem] to provide a plating treatment tool and a plating treatment device in which it is possible to suppress the occurrence of nodules even when the plating treatment tool rotates in a plating bath. [Solution] This plating treatment tool is used for immersing a disk-shaped substrate having a central hole in a plating liquid within a plating bath, wherein the plating treatment tool is characterized by including a support rod inserted through the central hole in the substrate, a restricting member provided with a rotation-suppressing mechanism that supports the support rod and suppresses rotation of the supported support rod, and a carousel to which the support rod is attached with the restricting member interposed therebetween.
Inventors:
Toru Fujii
Masaki Samura
Tsutomu Nishizaki
Yuhiro Shiiki
Yasuo Yamamoto
Masaki Samura
Tsutomu Nishizaki
Yuhiro Shiiki
Yasuo Yamamoto
Application Number:
JP2018548587A
Publication Date:
March 11, 2022
Filing Date:
September 27, 2017
Export Citation:
Assignee:
Kotetsu Kogyo Co., Ltd.
International Classes:
C23C18/31
Domestic Patent References:
| JP11209877A | ||||
| JP2007169757A | ||||
| JP2011231347A | ||||
| JP62033776A | ||||
| JP2001003177A | ||||
| JP11256347A | ||||
| JP8041649A |
Attorney, Agent or Firm:
Patent business corporation Ota patent office
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