To form wiring, or the like, which obviate the generation of voids and seams, and have reliability by stirring a plating liquid contg. a material reduced by the potential nobler than a reduction potential on a body to be plated with plating metal ions by using the liquid described above.
The plating liquid is formed by incorporating the material reduced by the potential nobler than the reduction potential on the body to be plated with the plating metal ions, such as copper, at a concn. of about 0.0001 to 1 mol/l into the liquid. The amt. of the material reduced by the potential nobler than the potential of the plating metal included in the plating liquid or the reductant thereof, which is included in the plating metal deposited on the surface of the body to be plated, is preferably ≤10 ppm. The plating liquid is stirred by blowing gas during the course of executing plating by using this plating liquid or by using a stirrer. The additive material effective when the plating liquid is copper includes materials, such as hydrogen peroxide, ammonium persulfate and benzoquinone, which are nobler in the reduction potential than the potential of the electrodeposition of copper.
HASHIBA TOSHIO
AKABOSHI HARUO
FUKADA SHINICHI
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| JPH1192987A | 1999-04-06 | |||
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| JPH01205090A | 1989-08-17 | |||
| JPH0397887A | 1991-04-23 | |||
| JPH0892794A | 1996-04-09 | |||
| JPH01252796A | 1989-10-09 | |||
| JPS5675590A | 1981-06-22 | |||
| JPS6369995A | 1988-03-30 | |||
| JPS513331A | 1976-01-12 |