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Title:
PLATED MATERIAL EXCELLENT IN HEAT RESISTANCE AND PRODUCTION METHOD THEREFOR
Document Type and Number:
Japanese Patent JP2017008365
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an Sn-plated material capable of maintaining desired heat resistance even at high temperature such as 175°C and a production method therefor.SOLUTION: There is provided the Sn-plated material in which a first ground layer composed of a Ni or Ni alloy, an intermediate layer composed of a CuSn compound and a surface layer composed of an Sn or Sn alloy are formed on a conductive substrate composed of a Cu or Cu alloy in this order. The Sn-plated material has 1 to 15 voids each with a length of 0.1 μm, per boundary length of 20 μm between the first ground layer and the intermediate layer when viewing a cross section in a vertical direction to a rolling direction. The production method for and a use of the Sn-plated material are also provided.SELECTED DRAWING: None

Inventors:
FUJII SHIGETO
KAWATA SHINGO
OKUNO YOSHIKAZU
TACHIBANA AKIRA
NAKATSUGAWA TATSUYA
Application Number:
JP2015124852A
Publication Date:
January 12, 2017
Filing Date:
June 22, 2015
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO LTD
International Classes:
C25D5/12; C25D5/50; C25D7/00
Domestic Patent References:
JP2005124852A2005-05-19
JP2010280946A2010-12-16
JPH02145794A1990-06-05
JP2014062322A2014-04-10
JP2004220871A2004-08-05
JP2008001947A2008-01-10
JP2007254860A2007-10-04
Foreign References:
US20140065440A12014-03-06
Attorney, Agent or Firm:
Toshizo Iida
Naosuke Miyamae