Title:
Plating material excellent in heat resistance, and a manufacturing method for the same
Document Type and Number:
Japanese Patent JP6219553
Kind Code:
B2
Abstract:
[Problem] To provide a Sn plating material capable of maintaining desired heat resistance and that does not crack during contact point formation even at a high temperature such as 175°C. [Solution] An Sn plating material (10) having a first ground layer (2) composed of Ni or a Ni alloy, an intermediate layer (4) composed of a CuSn compound, and a surface layer (5) composed of Sn or a Sn alloy in the stated order on an electroconductive substrate (1) composed of Cu or a Cu alloy, wherein the Sn plating material (10), when viewed in the cross section composed of the calendering and thickness directions, has a process-modified layer (6) with a length of 0.5 to 10 µm per 20 µm of boundary length of the first ground layer and the electroconductive substrate remaining on the surface of the electroconductive substrate, or has a plurality of process-modified layers (6) with a total length of 0.5 to 10 µm per 20 µm of boundary length.
Inventors:
Fujii Keito
Yoshikazu Okuno
Kawada Shingo
Akiyori Tachibana
Tatsuya Nakatsugawa
Shuichi Kitagawa
Yoshikazu Okuno
Kawada Shingo
Akiyori Tachibana
Tatsuya Nakatsugawa
Shuichi Kitagawa
Application Number:
JP2017528984A
Publication Date:
October 25, 2017
Filing Date:
August 30, 2016
Export Citation:
Assignee:
THE FURUKAW ELECTRIC CO.,LTD.
International Classes:
C25D7/00; C25D5/12; C25D5/34; C25D5/50; H01R13/03
Domestic Patent References:
| JP2015155560A | ||||
| JP2011195927A | ||||
| JP4006296A | ||||
| JP3880877B2 |
Attorney, Agent or Firm:
Toshizo Iida
Shuichi Akabane
Shuichi Akabane