Title:
PLATING MATERIAL, PRODUCTION METHOD THEREFOR, AND ELECTRICAL AND ELECTRONIC PART OBTAINED BY USING THE SAME
Document Type and Number:
Japanese Patent JP2003171790
Kind Code:
A
Abstract:
To provide a plating material which has satisfactory heat resistance as well as inserting and extracting properties.
The plating material is obtained, on the surface of an electrically conductive substrate 1, by forming a substrate plated layer 2 consisting of one kind of metal included in the groups 4, 5, 6, 7, 8, 9 or 10 in the Periodic Table, or an alloy essentially consisting of the same metal, an intermediate plated layer 3 consisting of Cu or a Cu alloy, and a surface plated layer 4 consisting of Sn or an Sn alloy in this order. The thickness of the surface plated layer 4 is ≥1.9 times that of intermediate plated layer 3.
More Like This:
| JPS5935694 | METHOD FOR PREVENTING FORMATION OF TIN WHISKER |
| WO/2014/178259 | ELECTRONIC COMPONENT |
Inventors:
TANAKA HITOSHI
MATSUDA AKIRA
SUZUKI SATOSHI
TANIMOTO MORIMASA
MATSUDA AKIRA
SUZUKI SATOSHI
TANIMOTO MORIMASA
Application Number:
JP2001388269A
Publication Date:
June 20, 2003
Filing Date:
December 20, 2001
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD
International Classes:
C25D5/10; C25D5/50; C25D7/00; (IPC1-7): C25D5/10; C25D5/50; C25D7/00
Domestic Patent References:
| JPH11135226A | 1999-05-21 | |||
| JPH06196349A | 1994-07-15 | |||
| JPH10134869A | 1998-05-22 | |||
| JPH04165096A | 1992-06-10 | |||
| JPH0339488A | 1991-02-20 | |||
| JPH11350188A | 1999-12-21 | |||
| JPH08176883A | 1996-07-09 | |||
| JPS61177393A | 1986-08-09 | |||
| JP2000164279A | 2000-06-16 |
Foreign References:
| US6083633A | 2000-07-04 |
Attorney, Agent or Firm:
Koji Nagato