Title:
PLATING METHOD AND PLATING COMPOSITION
Document Type and Number:
Japanese Patent JPS52156138
Kind Code:
A
Abstract:
This invention relates to a process and composition for the preparation of an electro-deposit which contains; at least one metal selected from the group consisting of nickel and cobalt or; binary or ternary alloys of the metals selected from nickel, iron, and cobalt; which comprises passing current from an anode to a cathode through an aqueous acidic electroplating solution containing at least one member selected from nickel compounds and cobalt compounds and which may additionally contain iron compounds providing nickel, cobalt and iron ions for electrodepositing nickel, cobalt, nickel-cobalt alloys, nickel-iron alloys, cobalt-iron alloys or nickel-iron-cobalt alloys; the improvement comprising the presence of 5 x 10-6 moles per liter to 0.5 mole per liter of an unsaturated cyclosulfone exhibiting the following generalized structural formula: wherein R1, R2, R3 and R4 are independently hydrogen, lower alkyl, or hydroxyl; FOR A TIME PERIOD SUFFICIENT TO FORM A METAL ELECTROPLATE UPON SAID CATHODE.
Inventors:
EDOWAADO POORU HAABURATSUKU
Application Number:
JP7274477A
Publication Date:
December 26, 1977
Filing Date:
June 18, 1977
Export Citation:
Assignee:
M & T CHEMICALS INC
International Classes:
C25D3/14; C25D3/56; (IPC1-7): C25D3/12; C25D3/56