To provide a plating method where the generation of defects caused by the interruption of the plating can be prevented, and to provide plating equipment utilized therefor.
The plating method comprises: a stage where the product to be plated is introduced into a plating liquid charged to a plating tank; a stage (120) where a first application current for plating to the product to be plated is applied to perform plating to the product to be plated; a stage (130) where, on the interruption of the plating, a second application current with a current quantity smaller than that of the first application current is applied to the anode, so that, during the interruption of the plating, the generation in the defects of the plating in the product to be plated is prevented; and a stage (140) where, after the dissolution of the interruption in the plating, the second application current is converted into the first application current, and the plating is continued to the product to be plated.
LEE JUN EUI
RI DOU
CHOI YOUNG CHEOL
UM TAE SEOG
