PLATING METHOD AND HIGH-FREQUENCY LINE - MITSUBISHI ELECTRIC CORP

Title:

PLATING METHOD AND HIGH-FREQUENCY LINE

Document Type and Number:

Japanese Patent JP2005210672

Kind Code:

A

Abstract:

To provide a plating method which can be applied to manufacturing a small-sized high-frequency line, and a high-frequency line which is manufactured by the plating method, can be miniaturized and reduces a transmission loss.

The method for plating a compound member including a first portion composed of a first resin including a charging material and a second portion composed of a material different from that of the first portion includes a pre-treatment step for treating the compound member using a surface treatment liquid with which the charging material is dissolved and a surface state of the second portion is not substantially changed, and a plating step for applying electroless plating to the compound material treated by the pre-treatment step, thereby selectively forming a plating film over the first portion.

Inventors:

YUASA TAKESHI
NISHINO TAMOTSU
INUZUKA TAKAYUKI
MURAKAMI OSAMU
MUKUDA MUNEAKI

Application Number:

JP2004154799A

Publication Date:

August 04, 2005

Filing Date:

May 25, 2004

Export Citation:

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Assignee:

MITSUBISHI ELECTRIC CORP

International Classes:

C23C18/16; C23C18/31; H01P1/02; H01P3/02; H01P3/04; H01P3/08; H01P5/08; H01P5/18; H01P11/00; (IPC1-7): H01P11/00; C23C18/16; C23C18/31; H01P1/02; H01P3/02; H01P3/04; H01P3/08; H01P5/08; H01P5/18

Attorney, Agent or Firm:

Osamu Kawamiya
Mikio Takeuchi

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