PURPOSE: To form a metallic layer which is satisfactory in its adherence property to a nonconductive member, by executing a chemical etching treatment of an ABS resin coating film on the surface of the nonconductive member, and after that, executing electroless metallic plating.

CONSTITUTION: As for a nonconductive member, plastic moldings, woodworking goods, china and porcelain, glass products, etc. are applicable. As for ABS resin, that of 20W30% butadiene is suitable, and it is melted in an organic solvent of methyl ethyl ketone, etc. within a range in which its concentration becomes about 20W80%, is applied thinly on an area to be plated, of the nonconductive member, and a coating film of about 10W100μm is formed by volatilizing the solvent. To the formed coating film, such pretreatments as chemical etching, neutralization, sensitizing treatment, rinsing, activating treatment, formalin treatment, etc., are executed in order, and after that, electroless metallic plating is executed. Also, as necessary, it is also possible to form a metallic layer on the metallic layer formed by the electroless plating, by means of electric plating.