Title:
めっき方法及びめっき装置
Document Type and Number:
Japanese Patent JP6781658
Kind Code:
B2
Abstract:
There is provided a method of supplying an indium ion to a plating solution for electrolytic plating using an insoluble anode. The method includes a step of preparing an acidic plating solution and a step of immersing indium metal in the plating solution and dissolving the indium metal in the plating solution without voltage application to the indium metal.
Inventors:
Youhei Wakuda
Mizuki Nagai
Tadashi Shimoyama
Mizuki Nagai
Tadashi Shimoyama
Application Number:
JP2017067836A
Publication Date:
November 04, 2020
Filing Date:
March 30, 2017
Export Citation:
Assignee:
Ebara Corporation
International Classes:
C25D21/14
Domestic Patent References:
| JP2009287118A | ||||
| JP49006977B1 | ||||
| JP2009242940A | ||||
| JP56102598A | ||||
| JP4214900A |
Foreign References:
| US20140158545 |
Attorney, Agent or Firm:
Shinjiro Ono
Toru Miyamae
Yukio Kanegae
Makoto Watanabe
Toru Miyamae
Yukio Kanegae
Makoto Watanabe