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Title:
PLATING METHOD FOR USING ANODE COMPARTMENT ATTACHED TO INSOLUBLE ANODE AND ITS DEVICE
Document Type and Number:
Japanese Patent JP2000109998
Kind Code:
A
Abstract:

To provide the plating method and plating device for conducting plating at a high current density and a high speed at the time of continuously electroplating a long strip-shaped metallic sheet by the use of an insoluble anode by replenishing a large amt. of the plating metal ion consumed in plating in a short time with a simple device.

An anode compartment 1 attached to an insoluble anode isolated from a bulk plating soln. by a diaphragm 3 is provided in a plating tank 10, a dissolution tank 40 is furnished outside the plating tank, a plating soln. is circulated between the anode compartment 1 and dissolution tank 40, the plating soln. lowered in pH by the electrolysis in the anode compartment 1 is sent to the dissolution tank 40, the plating metal is dissolved in the plating soln. with the solubility improved by the lowering of pH, then the plating soln. is supplied to the anode compartment 1 for anodization, and the process is repeated.


Inventors:
FUJIMOTO TERUNORI
TAYA SHINICHI
SHIMIZU NOBUYOSHI
Application Number:
JP28126098A
Publication Date:
April 18, 2000
Filing Date:
October 02, 1998
Export Citation:
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Assignee:
TOYO KOHAN CO LTD
International Classes:
C25D3/12; C25D3/56; C25D17/00; C25D17/12; C25D21/14; (IPC1-7): C25D17/00; C25D3/12; C25D3/56; C25D17/12; C25D21/14
Attorney, Agent or Firm:
Akio Ota