To provide a plating method of a wiring board having a conductive pattern with a metal layer including at least silver and copper being exposed on an external surface, the method being able to suppress precipitation in a part other than the conductive pattern and form an excellent plating layer on a surface of the conductive pattern.
A plating method of a wiring board comprises: a process (A) of processing a wiring board with first process liquid containing an oxidant; a process (B) of removing the oxidant from a surface of a conductive pattern by processing the wiring board after having undergone the process (A) with second process liquid that dissolves a copper oxide; a process (C) of removing a silver oxidant from the surface of the conductive pattern by processing the wiring board after having undergone the process (B) with third process liquid having a dissolving speed of a silver oxide (I) at a temperature of 25°C 1000 times or larger than a dissolving speed of copper (0) at a temperature of 25°C; and a step (D) of performing electroless plating on the conducting pattern of the wiring board after undergoing the process (C).
IMAI TETSUO
| JPH04352383A | 1992-12-07 | |||
| JP2009224651A | 2009-10-01 | |||
| JP2002118085A | 2002-04-19 | |||
| JP2003060111A | 2003-02-28 | |||
| JP2002252466A | 2002-09-06 |
Akihiko Yamashita
Kishimoto Tatsuto