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Title:
PLATING METHOD
Document Type and Number:
Japanese Patent JP2023032544
Kind Code:
A
Abstract:
To provide a plating method capable of using a non-conductive base material and easily peeling a seed layer and a plating layer.SOLUTION: A plating method comprises a seed layer forming step S2 and a first growing step S5. The seed layer forming step S2 forms a conducive diamond-like carbon film on the base material as a seed layer. The first growing step S5 forms a plating layer on the seed layer by electrolytic plating after the seed layer forming step S2.SELECTED DRAWING: Figure 1

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Inventors:
KAKIMURA TAKASHI
Application Number:
JP2021138737A
Publication Date:
March 09, 2023
Filing Date:
August 27, 2021
Export Citation:
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Assignee:
SCREEN HOLDINGS CO LTD
International Classes:
C25D1/10; C23C14/06; C23C16/27
Attorney, Agent or Firm:
Hidetoshi Yoshitake
Takahiro Arita



 
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