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Patent Searching and Data


Title:
PLATING METHOD
Document Type and Number:
Japanese Patent JPH07157879
Kind Code:
A
Abstract:

PURPOSE: To provide a plating method by storing hydrogen into a base material and using the stored hydrogen to reduce and deposite a metal.

CONSTITUTION: The plating method is executed by occluding hydrogen in the base material by passing or pressurizing hydrogen and after that, adding metallic salt or metallic salt aq. solution of one or more kind of Au, Ag, Pt, Pd, Rh, Ir, Ru, Os, Cu, Pb, Ni and Co to reduce and deposite the metal on the surface of the base material. As a result, the uniform and dense metal plating is enabled.


Inventors:
KIUCHI HIROMICHI
OKUDA AKIHIKO
Application Number:
JP33877393A
Publication Date:
June 20, 1995
Filing Date:
December 02, 1993
Export Citation:
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Assignee:
TANAKA PRECIOUS METAL IND
International Classes:
C23C18/18; C23C18/31; C23C18/44; (IPC1-7): C23C18/18; C23C18/31; C23C18/44