Title:
PLATING PROCESS METHOD
Document Type and Number:
Japanese Patent JPS53102837
Kind Code:
A
Abstract:
PURPOSE:To remove the residual deposit of the low-melting-point alloy on purpose to obtain a uniform mirror surface, by fixing the plating material on the pedestal frame through brazing with a low-melting-point alloy, and by removing the low-melting-point alloy through heating the brazed portion after plating process, and then, by applying the electrolytic polishing.
Inventors:
SAITOU SHIGERU
HAYASHI YUUJI
TOMIOKA HIROSHI
HASEGAWA HAJIME
BABA MASANORI
HAYASHI YUUJI
TOMIOKA HIROSHI
HASEGAWA HAJIME
BABA MASANORI
Application Number:
JP1771277A
Publication Date:
September 07, 1978
Filing Date:
February 22, 1977
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
H01H11/04; C23C2/00; C23C2/28; C25D17/08; (IPC1-7): C23C1/00; C25D7/00; C25D17/06; H01H1/00