Title:
めっき支援システム、めっき支援装置、めっき支援プログラムおよびめっき実施条件決定方法
Document Type and Number:
Japanese Patent JP7358251
Kind Code:
B2
Abstract:
A plating support system is provided and includes a simulator that predicts an in-plane uniformity value of a plating film formed on a substrate based on assumed conditions for an electroplating treatment of the substrate; a numerical analysis data storage unit that stores numerical analysis data in which each assumed condition is associated with the in-plane uniformity value for plural assumed conditions; a regression analysis unit that estimates a model that the in-plane uniformity value is an objective variable and variables of assumed conditions are explanatory variables by regression analysis based on the numerical analysis data; and an implement condition search unit that uses the estimated model to search for implement conditions that are recommended values of the assumed conditions related to the in-plane uniformity of the plating film formed in the electroplating treatment of the substrate to be plated.
Inventors:
Mitsuhiro Shamoto
Tadashi Shimoyama
Tsutomu Nakata
Eiji Aoyama
Masayuki Fujiki
Tadashi Shimoyama
Tsutomu Nakata
Eiji Aoyama
Masayuki Fujiki
Application Number:
JP2020005826A
Publication Date:
October 10, 2023
Filing Date:
January 17, 2020
Export Citation:
Assignee:
Ebara Corporation
International Classes:
G05B19/418; C25D21/12; G06F17/18; G06N5/04; G06N20/00
Domestic Patent References:
| JP2019168453A |
Foreign References:
| US20050109624 | ||||
| WO2016203757A1 |
Attorney, Agent or Firm:
Patent Attorney Firm Interbrain
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