Title:
めっきシステム、およびめっき方法
Document Type and Number:
Japanese Patent JP6741621
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a plating system and a plating method in which a circuit board can be plated while keeping metal ions in a plating solution into a desired concentration without metal powder being dispersed in a clean room.SOLUTION: A plating system comprises: a plating tank 2 for plating a circuit board; a main tank 18 configured so as to be able to hold a plating solution inside; a first temperature controller 39 for adjusting the temperature of the plating solution flowing in a plating solution supply line 21 to within the range of a predetermined plating temperature; a mixing tank 19 for producing a supplementary plating solution by dissolving powder including at least metal into the plating solution; a second temperature controller 73 for adjusting the temperature of the supplementary plating solution to a temperature higher than the range of the plating temperature; and a plating solution supplementary line 68 for connecting the mixing tank 19 to the main tank 18 or the plating solution supply line 21.SELECTED DRAWING: Figure 1
Inventors:
Haruharu
Junpei Fujikata
Junpei Fujikata
Application Number:
JP2017073851A
Publication Date:
August 19, 2020
Filing Date:
April 03, 2017
Export Citation:
Assignee:
Ebara Corporation
International Classes:
C25D21/14
Domestic Patent References:
| JP1060693A | ||||
| JP2001107258A | ||||
| JP2007051362A | ||||
| JP2000160390A | ||||
| JP9137298A | ||||
| JP2017141503A |
Attorney, Agent or Firm:
Tetsuya Hirosawa
Isamu Watanabe
Isamu Watanabe