Title:
PLATING TREATMENT METHOD, PLATING TREATMENT APPARATUS, AND STORAGE MEDIUM
Document Type and Number:
Japanese Patent JP2016044331
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To form a plating layer having a uniform thickness with respect to a substrate having a recessed part.SOLUTION: A plating treatment method comprises: a first plating process S21 of supplying a first plating solution to a substrate 2 having a recessed part 12 to form a first plating layer 13; and a second plating process of supplying a second plating solution to the substrate 2 after the first plating process S21 to form a second plating layer 14 on the first plating layer 13. The concentration of an additive contained in the first plating solution is different from that of an additive contained in the second plating solution. The first plating process S21 includes the steps of: rotating the substrate 2 at a first speed to form a discontinuous film of the first plating layer or a granular first plating layer on the substrate 2; and rotating the substrate 2 while repeating second and third speeds.SELECTED DRAWING: Figure 1
Inventors:
INATOMI YUICHIRO
TANAKA TAKASHI
TANAKA TAKASHI
Application Number:
JP2014169670A
Publication Date:
April 04, 2016
Filing Date:
August 22, 2014
Export Citation:
Assignee:
TOKYO ELECTRON LTD
International Classes:
C23C18/16; C23C18/34; C23C18/40
Domestic Patent References:
| JP2013251344A | 2013-12-12 | |||
| JP2013251344A | 2013-12-12 |
Foreign References:
| WO2013180064A1 | 2013-12-05 | |||
| WO2005038088A1 | 2005-04-28 | |||
| WO2013180064A1 | 2013-12-05 | |||
| WO2005038088A1 | 2005-04-28 |
Attorney, Agent or Firm:
Hirohito Katsunuma
Hiroyuki Nagai
Hideyuki Mori
Hiroyuki Nagai
Hideyuki Mori
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