Title:
PLATINUM ALLOY PLATING BATH AND PRODUCTION OF PLATINUM ALLOY-PLATED ARTICLE USING THE BATH
Document Type and Number:
Japanese Patent JP3171646
Kind Code:
B2
Abstract:
PURPOSE: To form a platinum alloy plating film capable of being thickened and with the luster and hardness being better than those of pure platinum by using a platinum alloy plating soln. contg. at least one kind of metal ion among Sn, Zn and Pd in addition to Pt in electroplating.
CONSTITUTION: A platinum alloy electroplating soln. contg. 1-100g/l of Pt as a Pt(OH)62- complex ion and ≥1 kind of metal ion among Sn, Zn and Pd and kept at pH ≥7 and 60°C is used, and electroplating is carried out with a DC or pulse current. In this case, Sn is added as sodium stannate or potassium stannate, Zn is added to form Zn(OH)3- or Zn(OH)42- as Zn ion, Pd is added as Pd(NH3)2Cl2 to form (Pd(NH3)2)2+, etc., the total amt. of the additives is controlled to 50mg/l to 100g/l, and further amidosulfuric acid or its Na salt, K salt, etc., are added to obtain a plating soln. to be used.
Inventors:
Toshiaki Yarida
Application Number:
JP9746192A
Publication Date:
May 28, 2001
Filing Date:
March 25, 1992
Export Citation:
Assignee:
Nippon Electroplating Engineers Co., Ltd.
International Classes:
C25D3/56; (IPC1-7): C25D3/56
Domestic Patent References:
| JP59226190A | ||||
| JP2107794A | ||||
| JP5110130A | ||||
| JP4419683B1 | ||||
| JP225994B2 | ||||
| JP4532606B1 | ||||
| JP6158557B2 | ||||
| JP6349758B2 |
Attorney, Agent or Firm:
Daisuke Tanaka
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