Title:
Polish device
Document Type and Number:
Japanese Patent JP6027664
Kind Code:
B2
More Like This:
Inventors:
Hitoshi Tokutake
Application Number:
JP2015210108A
Publication Date:
November 16, 2016
Filing Date:
October 26, 2015
Export Citation:
Assignee:
Matsuda Manufacturing Co., Ltd.
International Classes:
B24B9/00; B24B29/00
Domestic Patent References:
| JP2000167754A | ||||
| JP2007190657A | ||||
| JP62192862U | ||||
| JP6063858A | ||||
| JP2008260127A |
Attorney, Agent or Firm:
Takeshi Nakatani