To provide a polishing pad can suppress aggregation of abrasive particles and improving evenness of a polished object.
The polishing pad 1 has a film formed of polyurethane resin. The film is manufactured by dry type molding, and is manufactured by casting mixed liquid obtained by mixing an isocyanate group containing compound, a polyamine compound as a hardening agent and fine particles serving as a foaming factor and having thermal expansion characteristics to a mold and slicing a hardened foam while pressurizing it. Inside the film, much foaming generated by expansion of the fine particles by hardening reaction heat, etc. is formed. Each foaming has a shape of an ellipse in the same direction by the pressurizing processing during hardening. Multiple opening holes 4 are formed on the polishing face of the film obtained by slicing the foaming. Each of the opening holes 4 is formed to have a shape of an ellipse in the same direction. Retention of slurry in the opening holes 4 is suppressed.
TANAKA HISAAKI
MIYAZAWA FUMIO
| JP2007245298A | 2007-09-27 | |||
| JP2003209078A | 2003-07-25 | |||
| JP2001088013A | 2001-04-03 | |||
| JP2000202764A | 2000-07-25 |