Title:
POLISHING DEVICE
Document Type and Number:
Japanese Patent JP2017109295
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a polishing device capable of maintaining high polishing accuracy, and reducing abrasion of the device itself.SOLUTION: A polishing wire 10 stretched between a plurality of wheels 20 is supported by an auxiliary wire 13 abutting on and running parallel to the polishing wire 10, and movement and deflection to a longitudinal direction crossing a traveling direction are suppressed by the auxiliary wire 13. Hereby, high polishing accuracy can be maintained, and abrasion of a device itself can be reduced.SELECTED DRAWING: Figure 1
Inventors:
KOBAYASHI NOBUHIKO
KODAIRA YUYA
KODAIRA YUYA
Application Number:
JP2015257779A
Publication Date:
June 22, 2017
Filing Date:
December 14, 2015
Export Citation:
Assignee:
TAIYO KOGYO CO LTD
International Classes:
B24B21/00; B24D11/00
Domestic Patent References:
| JPH0911109A | 1997-01-14 | |||
| JP2011177883A | 2011-09-15 |
Previous Patent: A robot for construction work
Next Patent: A method, a system, and a program which generate a simulation sensor signal
Next Patent: A method, a system, and a program which generate a simulation sensor signal