POLISHING AGENT AND ADDITION AGENT THEREFOR

Title:

POLISHING AGENT AND ADDITION AGENT THEREFOR

Document Type and Number:

Japanese Patent JP2005347579

Kind Code:

A

Abstract:

To provide an addition agent suitable for a polishing agent for CMP and the polishing agent using it which makes fast polishing and high dishing suppression effect compatible.

The addition agent suitable for the polishing agent comprises a water-soluble compound which has iminodiacetic acid (salt) group and where the number of carbon atoms and the number of nitride atoms satisfies the relation of the number of carbon atoms/the number of nitride atoms >7 (this calculation is conducted excepting for the number of carbon atoms and the number of nitride atoms at the salt part in the case of having the iminodiacetic acid salt group), or a water-soluble polymer compound containing the iminodiacetic acid (salt) machine. The polishing agent contains the addition agent for the polishing agent.

More Like This:

JPS63102870	PRESSURE DEVICE FOR LAPPING BOWL
JP2003313540	POLISHING COMPOSITION
JPH09300208	DRESSER

Inventors:

YAMASHITA TAKESHI
AIZAWA RYUJI
KURAMOTO SHIGEFUMI
MATSUMI YASUO
KATSUTA OSAYUKI

Application Number:

JP2004166360A

Publication Date:

December 15, 2005

Filing Date:

June 03, 2004

Export Citation:

Click for automatic bibliography generation Help

Assignee:

NIPPON CATALYTIC CHEM IND
SUMITOMO CHEMICAL CO

International Classes:

B24B37/00; C09K3/14; H01L21/304; (IPC1-7): H01L21/304; B24B37/00; C09K3/14

Domestic Patent References:

JP2003017448A

2003-01-17

Attorney, Agent or Firm:

Takehiko Matsumoto

Previous Patent: SEMICONDUCTOR MEMORY DEVICE INCREASING DENSITY OF ARRAY OF PAIR TRANSISTORS

Next Patent: CRYSTALLINE THIN FILM, METHOD OF FORMING THE SAME, SEMICONDUCTOR DEVICE THEREOF, AND DISPLAY DEVICE