Title:
POLISHING AGENT, POLISHING AGENT SET, AND METHOD FOR POLISHING SUBSTRATE
Document Type and Number:
Japanese Patent JP2015232083
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a polishing agent which, in a CMP technique of polishing an insulation material using a stopper, can provide excellent selectivity for polishing the insulation material for the stopper material and can highly flatten a substrate surface after polishing.SOLUTION: The polishing agent comprises a liquid medium, abrasive particles containing a hydroxide of a tetravalent metal element, a first additive, a second additive, and a third additive. The first additive is at least one selected from the group consisting of polyalkylene glycols, polyoxyalkylene derivatives, polyglycerols, vinyl alcohol polymers, and α-glucose polymers. The second additive is a cationic polymer. The third additive is a metal salt compound containing at least one metal selected from the group consisting of Group 1, 9, 10, 11, 12, and 13 elements.
Inventors:
MINAMI HISATAKA
IWANO TOMOHIRO
AKUTSU TOSHIAKI
IWANO TOMOHIRO
AKUTSU TOSHIAKI
Application Number:
JP2014119510A
Publication Date:
December 24, 2015
Filing Date:
June 10, 2014
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C09K3/14; B24B37/00; H01L21/304
Foreign References:
| WO2013125446A1 | 2013-08-29 | |||
| WO2014034358A1 | 2014-03-06 |