To ensure high reliability wiring connection by stabilizing voltage application from an electrode, and to attain in-plane uniformity of wafer by preventing a polishing residue of a Cu film.

The polishing apparatus is provided with a carrier 510 for holding a wafer 300; a polishing pad 530 which is provided opposite to the carrier 510 to electropolish the wafer 300; and an electrode sheet 570 which is arranged opposite to the polishing pad 530, namely on the opposite side of the carrier 510, and becomes a cathode electrode to be electrically energized between the polishing pad 530 and itself, while the polishing pad 530 is used as an anode electrode.