To reduce the damage of a polished workpiece when it is taken out.
A piezoelectric plate 208 is manufactured by sandwiching a plate shape piezoelectric element between an upper polishing surface plate 402 and a lower polishing surface plate 404, and by turning the upper polishing surface plate 402 and the lower polishing surface plate 404 in the opposite directions respectively, and by polishing the plate shape piezoelectric element. After the polishing has been completed, the upper polishing surface plate 402 and the lower polishing surface plate 404 are separated upward and downward respectively. The attractive force of the upper polishing surface plate 402 is larger than the total force of the attractive force of the lower polishing surface plate 404 and the self-weight force of the piezoelectric plate 208. Therefore, the piezoelectric plate 208 is separated from the lower polishing surface plate 404, and is lifted upward in the state that the piezoelectric plate 208 has been attracted by the upper polishing surface plate 402. After the upper polishing surface plate 402 and the lower polishing surface plate 404 have been separated upward and downward respectively, a peeling fluid is discharged from a nozzle 412, and is supplied between the polishing surface 402A of the upper polishing surface plate 402 and the piezoelectric plate 208 in order to weaken the attractive force between the polishing surface 402A and the piezoelectric plate 208. As a result, the piezoelectric plate 208 is peeled from the upper polishing surface plate 402 by the weight of the piezoelectric plate 208. The peeled piezoelectric plate 208 drops on the lower polishing surface plate 404, and is collected so as not to fracture.
KANDA TORAHIKO
Kato Kazunori
Katsuichi Nishimoto
Hiroshi Fukuda