To provide a polishing composition that can suppress recess or dishing and is high in polishing rate.

The polishing composition is preferable to a metallic film, preferably a copper film and contains ammonia, ammonium salt and hydrogen peroxide, organic acid having two or more carboxyl radicals, and anticorrosive, and the residue is water. By containing these components, this composition is used particularly for a second step polishing, recess and dishing are suppressed. Maleic acid, oxalic acid and fumaric acid are preferable as the organic acid, and benzotriazol is preferable as the anticorrosive.