Title:
POLISHING COMPOSITION
Document Type and Number:
Japanese Patent JP2016141765
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a polishing composition which can polish a sapphire wafer at an excellent polishing rate.SOLUTION: A polishing composition comprises a silica particle, a glycol ether compound, and water. A content of the glycol ether compound in the polishing composition is 0.1 mass% or more and 10 mass% or less.SELECTED DRAWING: None
Inventors:
EZAWA SHUNJI
OTO TAKESHI
CHINEN MIKA
MORIYAMA KAZUKI
OTO TAKESHI
CHINEN MIKA
MORIYAMA KAZUKI
Application Number:
JP2015019946A
Publication Date:
August 08, 2016
Filing Date:
February 04, 2015
Export Citation:
Assignee:
NITTA HAAS INC
International Classes:
C09K3/14; B24B37/00; C09G1/02; H01L21/304
Domestic Patent References:
| JP2009147394A | 2009-07-02 | |||
| JP2011205113A | 2011-10-13 | |||
| JP2006269908A | 2006-10-05 |
Attorney, Agent or Firm:
Hidetoshi Ueba
Takao Matsuyama
Go Sakane
Takao Matsuyama
Go Sakane
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