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Title:
POLISHING DEVICE AND DRESSING METHOD OF POLISHING TOOL
Document Type and Number:
Japanese Patent JP2004042213
Kind Code:
A
Abstract:

To provide a polishing device for performing polishing of a base board at a stable high polishing speed by performing dressing by the light for preventing an abrasive grain from falling off on a polishing surface, effectively removing influence of a product material generated by this dressing, and stably supplying the abrasive grain autogenous on the polishing surface of a polishing tool.

This polishing tool 13 includes the abrasive grain and a binder for fixing the abrasive grain, and has the polishing tool 13 for polishing a polishing object W by being pressed to the polishing object W, a light source 31 for irradiating to the polishing surface 15 of the polishing tool 13 with a beam of light for weakening fixing force for fixing the abrasive grain of the binder and a foreign matter removing device for forcibly removing foreign matters generated by polishing or those generated by irradiation.


Inventors:
KOJIMA SHIYUNICHIROU
HIROKAWA KAZUTO
KODERA AKIRA
Application Number:
JP2002204498A
Publication Date:
February 12, 2004
Filing Date:
July 12, 2002
Export Citation:
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Assignee:
EBARA CORP
International Classes:
B24B53/00; B24B53/007; B24B53/02; B24D3/34; H01L21/304; (IPC1-7): B24B53/00; B24B53/02; H01L21/304
Attorney, Agent or Firm:
Sadaji Miyakawa
Kiyoshi Miyakawa
Hiroyuki Matsumura
Hirofumi Higashino
Kazuo Takahashi