To provide a polishing device for performing polishing of a base board at a stable high polishing speed by performing dressing by the light for preventing an abrasive grain from falling off on a polishing surface, effectively removing influence of a product material generated by this dressing, and stably supplying the abrasive grain autogenous on the polishing surface of a polishing tool.
This polishing tool 13 includes the abrasive grain and a binder for fixing the abrasive grain, and has the polishing tool 13 for polishing a polishing object W by being pressed to the polishing object W, a light source 31 for irradiating to the polishing surface 15 of the polishing tool 13 with a beam of light for weakening fixing force for fixing the abrasive grain of the binder and a foreign matter removing device for forcibly removing foreign matters generated by polishing or those generated by irradiation.
HIROKAWA KAZUTO
KODERA AKIRA
Kiyoshi Miyakawa
Hiroyuki Matsumura
Hirofumi Higashino
Kazuo Takahashi