To provide a polishing device for a full automatic micro drill and a polishing method therefor which reduce installation cost for facilities and effectively improve efficiency and quality during polishing of a micro drill.

As the polishing device for the full automatic micro drill and the polishing method therefor, the device includes a base, a brush device, a removal module, a holding module, a first inspection module, a second inspection module, and a polishing module. With them, a micro drill before polishing and inspection is moved to the holding module, dust is removed concurrently in the moving process, and subsequently, first inspection is conducted. A micro drill determined as passed undergoes primary polishing by the polishing module, and a defective micro drill is sent to a defective product section. The micro drill with the primary polishing completed therefor proceeds to secondary inspection, and the good product is sent to a delivery section, and the defective product proceeds to the secondary polishing after repeating the previously described steps, and the good product is sent to the delivery section. As for a product which is still defective is moved to the defective product section, thus achieving automated micro drill polishing to improve the efficiency and quality thereof.