Title:
POLISHING DEVICE, INFORMATION PROCESSING SYSTEM, INFORMATION PROCESSING METHOD, AND PROGRAM
Document Type and Number:
Japanese Patent JP2021058955
Kind Code:
A
Abstract:
To provide a method for estimating the wiring height of a substrate during polishing.SOLUTION: A polishing device includes: a polishing table 110 provided with an eddy current sensor 150 and configured to be rotatable; a polishing head 120 configured to be rotatable and having a substrate 121 mountable on a plane facing the polishing table 110; and a processor 142 for executing predetermined pre-processing on an output signal in the case that the eddy current sensor 150 is located at each position facing the object substrate 121 to generate data after the pre-processing during polishing processing of the object substrate 121, and determining a wiring height at at least one position of the object substrate 121 by inputting the data after the pre-processing to a learned machine learning model by using a learning data set with the data after executing the predetermined pre-processing of the output signal in the case that the eddy current sensor 150 is located at each position facing the substrate 121 as an input and with the wiring height at at least one position of the substrate 121 as an output.SELECTED DRAWING: Figure 1
Inventors:
NAKAMURA AKIRA
Application Number:
JP2019183750A
Publication Date:
April 15, 2021
Filing Date:
October 04, 2019
Export Citation:
Assignee:
EBARA CORP
International Classes:
B24B37/013; B23Q15/12; B24B37/30; B24B49/04; B24B49/10; G05B19/404; G05B19/4155; H01L21/304
Attorney, Agent or Firm:
Seiji Ohno
Kobayashi Hideyoshi
Hiroyuki Ohno
Koji Morita
Osamu Tsuda
Matsuno Chihiro
Seiichi Sakitani
Hiroshi Nomoto
Kobayashi Hideyoshi
Hiroyuki Ohno
Koji Morita
Osamu Tsuda
Matsuno Chihiro
Seiichi Sakitani
Hiroshi Nomoto