To improve the uniformity of a polishing speed by arranging a slurry supply hole nonexistent area in a prescribed width in a concentrically circular shape toward the outer periphery from the center in a polishing pad.

The polishing surface having extremely high uniformity of a polishing speed is obtained by reliably performing polishing in the area by using a polishing pad having a slurry supply hole nonexistent area having a prescribed width. Sufficient uniformity of a polishing speed can be obtained when a width of the slurry supply hole nonexistent area is not less than 10% of a radius, but the width is more desirably set not less than 20% of the radius. A slurry supply hole is desirably arranged on the outer periphery of a pad, but is set to a range of at least 5% of the radius toward the center from the outer periphery, and is more desirably arranged so that the slurry supply hole is arranged on the outer periphery of a polishing object base board when the axes of a polishing surface plate and a carrier are adjusted to each other.