Title:
POLISHING DEVICE AND METHOD THEREOF
Document Type and Number:
Japanese Patent JP2000094311
Kind Code:
A
Abstract:
To provide a polishing device and a method thereof capable of easily controlling a guide ring for holding an object of polishing.
In a polishing device which has a turntable 24 with a polishing surface, a top ring body 3, and a guide ring 5 for holding a semiconductor-wafer 6 around the top ring body 3, and which polishes the semiconductor-wafer 6 by interposing the semiconductor-wafer 6 between the turntable 24 and the top ring body 3 and pressing it by a specified pressure, the guide ring 5 is provided so that it can be moved vertically with respect to the top ring body 3, and means 3-3, 27 for fixing and detaching the guide ring 5 to and from the top ring body 3 are provided.
Inventors:
ONO KOJI
NISHI TOYOMI
KIMURA NORIO
NISHI TOYOMI
KIMURA NORIO
Application Number:
JP27521398A
Publication Date:
April 04, 2000
Filing Date:
September 29, 1998
Export Citation:
Assignee:
EBARA CORP
International Classes:
B24B37/04; B24B37/30; B24B37/32; H01L21/304; (IPC1-7): B24B37/04; H01L21/304
Attorney, Agent or Firm:
Isamu Watanabe (2 outside)