To provide a polishing device and method capable of performing accurate polishing without the polishing unevenness caused by the cyclic groove structure formed in the face of the polishing face of a polishing pad in the polishing device using a polishing pad having a polishing face of 1 to 2 times the diameter of a workpiece.

A holding table 12 is made to swing by arranging the swing center Owc of the rotation axis Ow of the holding table 12, which holds a workpiece 11 separately by a distance D from the rotation axis O of a polishing head which holds the polishing pad 13 in the polishing face of which a cyclic groove structure 30 is formed, and by setting the maximum value B of distance between the rotation axis O of the polishing head and the rotation axis Ow of the holding table 12 which are separated from each other due to the swinging of the holding is set to a value larger than the value (D+T) obtained by adding the cyclic length T of a groove structure 30 to a separation distance D and smaller than the value obtained by subtracting the radius W of a body 11 to be polished from the radius P of the polishing face of the polishing pad 13 when the holding table 12 is made to swing before and behind the swinging center Owc.