POLISHING DEVICE AND METHOD

Title:

POLISHING DEVICE AND METHOD

Document Type and Number:

Japanese Patent JP2002307294

Kind Code:

A

Abstract:

To provide a polishing device and method capable of obtaining stability of a polishing speed and excellent flatness, and excellently reducing defects (scratches) generated on a polishing face of a polishing target object such as a semiconductor wafer to various kinds of the polishing target objects.

This polishing device polishes the polishing target object through abrasive grains by pressing the polishing target object onto a polishing instrument 1 and sliding the polishing target object. The polishing instrument 1 includes a highly water absorptive material 5. As the high water absorptive material 5, polyacrylic acid, polyvinyl acetal, polyvinyl pyrralidone, polyvinyl alcohol, polyethylene imine, polyethylene oxide, a styrene-maleic anhydride copolymer, polyvinyl amine, polyallylamine, an oxazoline group-containing water-soluble resin, a water-soluble melamine resin, a water-soluble urea resin, an alkyd resin, sulfonamide or the like can be used.

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Inventors:

HIROKAWA KAZUTO
HIYAMA HIROKUNI
WADA TAKETAKA
MATSUO NAONORI

Application Number:

JP2001115946A

Publication Date:

October 23, 2002

Filing Date:

April 13, 2001

Export Citation:

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Assignee:

EBARA CORP

International Classes:

B24B37/20; B24B37/24; B24D3/02; B24D3/28; B24D3/34; H01L21/304; (IPC1-7): B24B37/00; B24D3/02; B24D3/28; B24D3/34; H01L21/304

Attorney, Agent or Firm:

Isamu Watanabe (3 outside)

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