To control a temperature of a polishing pad by spraying a gas to a surface of the polishing pad, suppress deterioration of a polishing rate due to an insufficient polishing liquid feed rate to a polishing interface between a substrate and the polishing pad, and maintain the polishing rate appropriately.
A polishing method includes the steps of controlling the temperature of the polishing pad by spraying the gas to the polishing pad, and polishing the substrate by bringing the substrate into sliding contact with the surface of the polishing pad to which the polishing liquid is fed. A gas flow rate sprayed to the polishing pad at polishing of the substrate and a polishing liquid flow rate fed to the polishing pad are mutually interlocked. For instance, the polishing liquid flow rate fed to the polishing pad at the polishing of the substrate is adjusted based on data showing correlations between the gas flow rate sprayed to the polishing pad at the polishing of the substrate and the required polishing liquid flow rate fed to the polishing pad.
WO/2013/153880 | METHOD FOR POLISHING GLASS SUBSTRATE |
JP2003057027 | MEASURING INSTRUMENT |
JP4710952 | Polishing equipment |
ISHII YU
ONO KATSUTOSHI
JPH10156708A | 1998-06-16 | |||
JPH11188612A | 1999-07-13 | |||
JPH08281551A | 1996-10-29 | |||
JPH11114811A | 1999-04-27 | |||
JP2008103496A | 2008-05-01 | |||
JP2004306173A | 2004-11-04 | |||
JP2008277450A | 2008-11-13 | |||
JP2005342841A | 2005-12-15 | |||
JP2011079076A | 2011-04-21 | |||
JPH09109019A | 1997-04-28 | |||
JP2007181910A | 2007-07-19 | |||
JPH02199832A | 1990-08-08 | |||
JPH10309661A | 1998-11-24 | |||
JPH10156708A | 1998-06-16 | |||
JPH11188612A | 1999-07-13 | |||
JPH08281551A | 1996-10-29 | |||
JPH11114811A | 1999-04-27 | |||
JP2008103496A | 2008-05-01 | |||
JP2004306173A | 2004-11-04 | |||
JP2008277450A | 2008-11-13 | |||
JP2005342841A | 2005-12-15 | |||
JP2011079076A | 2011-04-21 |
Ryoji Kosugi
Tetsuya Hirosawa