Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
POLISHING DEVICE AND POLISHING METHOD
Document Type and Number:
Japanese Patent JP2015131361
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a polishing device and a polishing method capable of promptly cooling the polishing surface of a polishing pad and attaining highly accurate polishing conditions according to a polishing target.SOLUTION: A polishing device 10 comprises: a polishing pad 12; and a coolant spray unit 13. The polishing pad 12 includes a polishing surface 18 in contact with a polishing target. The coolant spray unit 13 sprays coolant cooling the polishing pad 18 by heat of evaporation, onto the polishing surface 18.

Inventors:
WATANABE TAKASHI
Application Number:
JP2014003254A
Publication Date:
July 23, 2015
Filing Date:
January 10, 2014
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TOSHIBA CORP
International Classes:
B24B55/02; B24B37/015; H01L21/304
Domestic Patent References:
JP2003068681A2003-03-07
JPH11347935A1999-12-21
JP2000079553A2000-03-21
JP2012148376A2012-08-09
JP2004042217A2004-02-12
Foreign References:
US6000997A1999-12-14
US20130185924A12013-07-25
Attorney, Agent or Firm:
Patent Business Corporation Sato International Patent Office



 
Previous Patent: POLISHING DEVICE

Next Patent: PROCESSING METHOD AND PROCESSING TOOL OF WORK PIECE