Title:
POLISHING DEVICE AND POLISHING METHOD
Document Type and Number:
Japanese Patent JP2015213978
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To facilitate position alignment when a polishing pad is attached to a platen.SOLUTION: The polishing device includes: a detection unit 16 that radiates light 28 to a wafer 66 held on a polishing head 60 to detect an end point of polishing on the wafer 66; and a platen 10 which has a top face provided with a platen-side window 22 which allows passage of the light 28 which overlaps with a pad-side window 44 of a first polishing pad 40a including the pad-side window 44 which allows passage of the light 28, and which has a first projecting portion 24 to be inserted into a first hole 46 formed through the first polishing pad 40a.
Inventors:
AKABOSHI FUMIHIKO
Application Number:
JP2014097569A
Publication Date:
December 03, 2015
Filing Date:
May 09, 2014
Export Citation:
Assignee:
FUJITSU SEMICONDUCTOR LTD
International Classes:
B24B37/013; B24B37/11; H01L21/304
Domestic Patent References:
| JP2015009340A | 2015-01-19 | |||
| JP2001319901A | 2001-11-16 | |||
| JP2004001160A | 2004-01-08 | |||
| JP2004090106A | 2004-03-25 | |||
| JP2001291686A | 2001-10-19 |
Attorney, Agent or Firm:
Shuhei Katayama