POLISHING DEVICE AND POLISHING METHOD

Japanese Patent JP2021178370

A

To reduce a polishing liquid used amount and/or suppress deterioration of polishing quality.SOLUTION: A polishing device includes: a polishing table which is for supporting and rotating a polishing pad; a holding body which holds an object so as to press the object to the polishing pad; a polishing liquid supply device which has a contact member and spreads polishing liquid on the polishing pad by supplying polishing liquid to an opening of a bottom face of the contact member in a state that the contact member is in contact with or adjacent to the polishing pad, and the polishing liquid supply device in which at least a part of used polishing liquid which is returned by rotation of the polishing pad is dammed by the contact member and the contact member takes on the dammed polishing liquid in a direction for keeping the polishing liquid on the polishing pad or in a direction for discharging the polishing liquid according to an angle to a radial direction of the polishing pad; an arm which is connected to the polishing liquid supply device; a rotation mechanism which rotates the polishing liquid supply device with respect to the arm; and a control device which controls the rotation mechanism to change the angle of the polishing liquid supply device with respect to the radial direction of the polishing pad and controls a discharge amount of polishing liquid by the contact member of the polishing liquid supply device.SELECTED DRAWING: Figure 10A

JP3640504	DRESSING METHOD AND DEVICE
JP6965996	Slurry and polishing method

ITO MASAYOSHI
MATSUO NAONORI
OBATA ITSUKI
MORIURA TAKUYA

JP2020083404A

November 18, 2021

May 11, 2020

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EBARA CORP

B24B37/00; B24B37/10; B24B37/34; B24B49/04; B24B57/02; H01L21/304

Toru Miyamae
Yukio Kanegae
Tatsumi Ono
Makoto Watanabe

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