Title:
POLISHING DEVICE AND POLISHING METHOD
Document Type and Number:
Japanese Patent JP2023064493
Kind Code:
A
Abstract:
To provide a polishing device which can polish a substrate accurately.SOLUTION: A polishing device includes: a rotatable polishing table 5; a polishing pad 2 attached to the polishing table 5; a polishing head 7 which presses a polished surface of a substrate W to a polishing surface 2a of the polishing pad 2; and a pad pressing head 50 which presses the polishing surface 2a of the polishing pad 2 to the polished surface of the substrate W.SELECTED DRAWING: Figure 1
Inventors:
NAMIKI KEISUKE
Application Number:
JP2021174816A
Publication Date:
May 11, 2023
Filing Date:
October 26, 2021
Export Citation:
Assignee:
EBARA CORP
International Classes:
B24B37/005; B24B37/015; B24B37/30; B24B49/04; B24B49/10; B24B49/12; B24B53/017; B24B53/12; H01L21/304
Attorney, Agent or Firm:
Tetsuya Hirosawa
Yutaro Watanabe
Goto Manabu
Mitsuhiro Kanazawa
Yutaro Watanabe
Goto Manabu
Mitsuhiro Kanazawa