Title:
POLISHING DEVICE AND POLISHING METHOD
Document Type and Number:
Japanese Patent JP3741523
Kind Code:
B
Abstract:
PROBLEM TO BE SOLVED: To facilitate terminal control of polishing by providing a polishing temperature control device for controlling polishing temperature at a contact face with the temperature of space accomodating a polishing device, as a variable factor.
SOLUTION: A temperature sensor 48 for detecting room temperature is fitted into a specified place of a polishing room 38, and its output is inputted to a control device 34. The control device 34 sends a control signal to an air conditioner 42 on the basis of the detected temperature and the value of previously inputted set polishing temperature and controls the supply air temperature of the air conditioner 42. Polishing temperature is regulated taking account of the temperature of polishing space 38 in addition.to the respective temperature of a polishing solution and a heat reserving medium for regulating the temperature of a polishing tool. The polishing temperature is the temperaure of a contact face between the surface of a polished wafer and the surface of a table on the polishing side or the surface of polishing cloth provided on the table 2.
Inventors:
Kawamoto, Takayoshi
Kimura, Norio
Yoshida, Hiroshi
Yasuda, Hozumi
Kimura, Norio
Yoshida, Hiroshi
Yasuda, Hozumi
Application Number:
JP1997000219148
Publication Date:
November 18, 2005
Filing Date:
July 30, 1997
Export Citation:
Assignee:
EBARA CORP
International Classes:
B24B37/00; B24B37/013; B24B37/015; B24B37/04; B24B49/14; H01L21/304; (IPC1-7): B24B37/00; H01L21/304