Title:
POLISHING DEVICE AND PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2019042923
Kind Code:
A
Abstract:
To perform finish processing of a processing object after main polishing while suppressing lowering of throughput of a polishing device.SOLUTION: A polishing device includes: a polishing unit 3 for polishing a processing object by relatively moving the processing object and a polishing tool while bringing the processing object into contact with the polishing tool; second conveying robots 6 and 7 for conveying an unpolished processing object to the polishing unit 3 and/or conveying the processing object after polishing from the polishing unit 3; and a cleaning unit 4. The cleaning unit 4 includes: at least one of cleaning modules 190 and 192; a buff processing module 300 for performing finish processing of the processing object; and a second conveying robot for conveying the processing object between the cleaning modules 190 and 192 and the buff processing module 300.SELECTED DRAWING: Figure 1
Inventors:
YAMAGUCHI KUNIAKI
MIZUNO TOSHIO
OBATA ITSUKI
MIYAZAKI MITSURU
TOYOMURA NAOKI
INOUE TAKUYA
MIZUNO TOSHIO
OBATA ITSUKI
MIYAZAKI MITSURU
TOYOMURA NAOKI
INOUE TAKUYA
Application Number:
JP2018222269A
Publication Date:
March 22, 2019
Filing Date:
November 28, 2018
Export Citation:
Assignee:
EBARA CORP
International Classes:
B24B41/06; B24B29/00; B24B37/10; B24B53/007; H01L21/304
Domestic Patent References:
JP2001009388A | 2001-01-16 | |||
JP2010135524A | 2010-06-17 | |||
JPH0871511A | 1996-03-19 | |||
JP2009059750A | 2009-03-19 | |||
JP2003151943A | 2003-05-23 | |||
JPH10223597A | 1998-08-21 | |||
JP2002198345A | 2002-07-12 |
Attorney, Agent or Firm:
Shinjiro Ono
Toru Miyamae
Yukio Kanegae
Makoto Watanabe
Toru Miyamae
Yukio Kanegae
Makoto Watanabe