研磨装置およびリテーナリング

Title:

研磨装置およびリテーナリング

Document Type and Number:

Japanese Patent JP7222844

Kind Code:

B2

Abstract:

According to one embodiment, a polishing apparatus includes a polishing head having a retainer surrounding a substrate to be polished, and a polishing pad facing the polishing head. The retainer includes a first material and a second material. The first material contains at least one of aromatic polyamide, polyphenylene sulfide, polyetherimide, polyamideimide, polyetheretherketone, or polybenzimidazole. The second material contains a fluororesin.

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Inventors:

Takahiko Kawasaki

Application Number:

JP2019146541A

Publication Date:

February 15, 2023

Filing Date:

August 08, 2019

Export Citation:

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Assignee:

Kioxia Co., Ltd.

International Classes:

B24B37/32; H01L21/304

Domestic Patent References:

JP2004146412A
JP2011224731A
JP2006502016A

Attorney, Agent or Firm:

Hiroyuki Nagai
Nakamura Yukitaka
Satoru Asakura
Takeshi Sekine
Akira Akaoka

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