Title:
POLISHING DEVICE FOR WAFER
Document Type and Number:
Japanese Patent JP3749305
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To facilitate mounting/demounting work of a surface plate, by providing a vacuum device mutually sucking a polishing surface plate and a surface plate receiving part so that the surface plate and the surface plate receiving part integrally formed can make a relative motion relating to a wafer.
SOLUTION: In a surface mounting a surface plate 14 of a flat plate part 12a in a surface plate receiving part 12, a groove-shaped vacuum passage 15 for vacuum sucking the surface plate 14 is formed. Further, the vacuum passage 15 is formed in a surface of the flat plate part 12a, to communicate with a vacuum source through a passage 15a of a shaft part 16. A reason that an area of the vacuum passage 15 is widely set even as compared with an area receiving the surface plate 14 is for increasing suction force, the passage is formed almost uniformly in a total surface, so as to disperse suction force, deformation of the surface plate 14 is prevented.
Inventors:
Norio Kudo
Yasuo Inada
Makoto Nakajima
Fukushima Government Law
Yasuo Inada
Makoto Nakajima
Fukushima Government Law
Application Number:
JP10496696A
Publication Date:
February 22, 2006
Filing Date:
April 25, 1996
Export Citation:
Assignee:
Fujikoshi Machine Industry Co., Ltd.
International Classes:
B24B37/12; H01L21/304; (IPC1-7): B24B37/04
Domestic Patent References:
| JP4206929A | ||||
| JP6039704A | ||||
| JP58028759Y2 | ||||
| JP4146072A |
Foreign References:
| WO1995029039A1 |
Attorney, Agent or Firm:
Takao Watanuki
Horimai Kazuharu
Horimai Kazuharu