To provide a polishing device for efficiently and safely polishing the entire periphery of a workpiece.

A first table 2a is movably disposed to the outer periphery of a buffing wheel 4 rotated and driven by a motor M1. A chuck device 20 for grappling one end of a cylindrical workpiece W and a centering holder 50 for supporting the other end are disposed on a second table 2b disposed on the first table 2a movably in the direction orthogonal to a moving direction of the first table 2a. The chuck device 20 and the centering holder 50 support both ends of the workpiece W, the first table 2a is moved toward the buffing wheel 4 for rotating the first table 2a in one direction in a rotating state of the workpiece W to press one end of the outer periphery of the workpiece W to the buffing wheel 4, and then the second table 2b is moved in the axial direction of the buffing wheel 4 to polish the entire periphery of the workpiece W by contacting with buffing wheel 4.