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Title:
POLISHING DEVICE
Document Type and Number:
Japanese Patent JP2012055979
Kind Code:
A
Abstract:

To provide a polishing device capable of efficiently removing foreign matter remaining in a polishing head.

The polishing device 1 includes: a polishing platen composed rotatably; a polishing pad disposed on the polishing platen; an abrasive feeding mechanism for supplying an abrasive on the polishing pad; a chuck plate 12 for pressing an object W to be polished to the polishing pad while holding the object W to be polished; a retainer ring 14 disposed to the outer circumference of the chuck plate 12 through the chuck plate 12 and a clearance G; and a liquid feed pipe 16 communicating with the clearance G.


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Inventors:
TAKAYANAGI KENTARO
TAKAHASHI WATARU
Application Number:
JP2010198611A
Publication Date:
March 22, 2012
Filing Date:
September 06, 2010
Export Citation:
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Assignee:
SEIKO EPSON CORP
International Classes:
B24B37/04; H01L21/304
Attorney, Agent or Firm:
Masahiko Ueyanagi
Osamu Suzawa
Kazuhiko Miyasaka



 
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