POLISHING DEVICE

Japanese Patent JP3803130

B2

PURPOSE: To provide a polishing device which can effectively prevent pollution and can be installed in a clean room.
CONSTITUTION: A polishing device is provided with a loading and unloading block 7 to deliver a cassette housing a wafer, a carrying block 8 to move the wafer from the cassette, a polishing block 6 to polish the wafer, a cleaning block 9 to clean and dry the wafer after it is polished and a control block 10 to control operation of the device, and has a wall plate on the periphery and the ceiling so as to cover the whole of these, and is constituted in a box shape. According to this polishing device, a semiconductor wafer is polished by the polishing block 6, and the polished semiconductor wafer is transferred to the cleaning block 9 from the polishing block. The semiconductor wafer is cleaned and dried. Therefore, the semiconductor wafer is taken out of the polishing device in a cleaned and dried condition.

JPH03178748	TOOL MANAGEMENT DEVICE
JPS57121410	PROCESSING OF THIN WALL CYLINDER

Toyomi Nishi
Tetsuji Togawa
Yajima Hiroumi
Kazuaki Hinata
Shoichi Kodama
Yukio Imoto
Riichiro Aoki
Masako Watase
Atsushi Shigeta
Shiro Mishima
Yoshisuke Kono

JP34479795A

August 02, 2006

December 06, 1995

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Ebara Corporation
Toshiba Corporation

B23Q11/00; H01L21/304; B24B37/00; B24B37/04; B24B55/06; (IPC1-7): B24B37/00; B23Q11/00; B24B55/06; H01L21/304

JP1144639A
JP647657A
JP3274746A
JP3184331A

Isamu Watanabe
Shintaro Hotta

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