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Patent Searching and Data


Title:
POLISHING DEVICE
Document Type and Number:
Japanese Patent JPH07237042
Kind Code:
A
Abstract:

PURPOSE: To provide a polishing device performing super-precision machining with a high accuracy while controlling the machined quantity of a workpiece and the wear quantity of a tool efficiently without causing a flaw to the surface of the workpiece and without any harm to a human body.

CONSTITUTION: In this polishing device, voltage is applied between a tool 3 mounted to the spindle 1 of a machine tool and a workpiece 9 submerged in electrolyte 7, stored in a machining tank 5 with abrasive grain dispersed therein, so as to cause an electrophoretic phenomenon to machine the workpiece 9 in the electrolyte 7. The tool 3 is formed of polymeric material obtained by mixing carbon fiber in thermoplastic resin, and the electrolyte 7 is polymeric electrolyte obtained by dissolving calboxymethylcellulose sodium (CMC) and abrasive grain of about 10μm in diameter in water. The polishing device is also provided with a voltage variable power unit 25.


Inventors:
SENBA TAKUYA
OHIRA KENGO
Application Number:
JP2987894A
Publication Date:
September 12, 1995
Filing Date:
February 28, 1994
Export Citation:
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Assignee:
MAKINO MILLING MACHINE
International Classes:
B23H5/00; B23H5/08; B23H5/10; B23H5/12; B24B37/00; (IPC1-7): B23H5/00; B23H5/08; B23H5/10; B23H5/12; B24B37/00
Attorney, Agent or Firm:
Takashi Ishida (3 others)